Thermal Transport in Oblique Finned Micro/Minichannels

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The main aim of this book is to introduce and give an overview of a novel, easy, and highly effective heat transfer augmentation technique for single-phase micro/minichannel heat sink. The specific objectives of the volume are to: Introduce a novel planar oblique fin microchannel and cylindrical oblique fin minichannel heat sink design using passive heat transfer enhancement techniques Investigate the thermal transport in both planar and cylindrical oblique fin structures through numerical simulation and systematic experimental studies.
Evaluate the feasibility of employing the proposed solution in cooling non-uniform heat fluxes and hotspot suppression Conduct the similarity analysis and parametric study to obtain empirical correlations to evaluate the total heat transfer rate of the oblique fin heat sink Investigate the flow mechanism and optimize the dimensions of cylindrical oblique fin heat sink Investigate the influence of edge effect on flow and temperature uniformity in these oblique fin channels.

Proposes a novel passive heat transfer enhancement technique Explains unique feature of oblique finned micro/minichannel: higher heat transfer enhancement with negligible pressure drop, as distinguished from conventional heat transfer enhancement techniques that impose increased pressure drop penalty Provides detailed theoretical analysis, numerical and experimental studies for oblique finned micro/minichannel Includes supplementary material: sn.pub/extras

Inhalt
Introduction.- Planar Oblique Fin Microchannel Heat Sink.- Cylindrical Oblique Fin Minichannel Heat Sink.- Thermal Management and Application for Oblique Fins.- Conclusions.- Appendix.- References.

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Weitere Informationen

  • Allgemeine Informationen
    • GTIN 09783319096469
    • Schöpfer Yan Fan, Poh Seng Lee, Pawan Kumar Singh
    • Sprache Englisch
    • Auflage 2015
    • Größe H235mm x B155mm x T8mm
    • Jahr 2014
    • EAN 9783319096469
    • Format Kartonierter Einband
    • ISBN 331909646X
    • Veröffentlichung 05.11.2014
    • Titel Thermal Transport in Oblique Finned Micro/Minichannels
    • Autor Yan Fan , Yong Jiun Lee , Pawan Kumar Singh , Poh Seng Lee
    • Untertitel SpringerBriefs in Applied Sciences and Technology - SpringerBriefs in Thermal En
    • Gewicht 257g
    • Herausgeber Springer International Publishing
    • Anzahl Seiten 144
    • Lesemotiv Verstehen
    • Genre Mathematik

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