Chemical Vapor Deposition

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In early 1987 I was attempting to develop a CVD-based tungsten process for Intel. At every step ofthe development, information that we were collecting had to be analyzed in light of theories and hypotheses from books and papers in many unrelated subjects. Thesesources were so widely different that I came to realize there was no unifying treatment of CVD and its subprocesses. More interestingly, my colleagues in the industry were from many disciplines (a surface chemist, a mechanical engineer, a geologist, and an electrical engineer werein my group). To help us understand the field of CVD and its players, some of us organized the CVD user's group of Northern California in 1988. The idea for writing a book on the subject occurred to me during that time. I had already organized my thoughts for a course I taught at San Jose State University. Later Van Nostrand agreed to publish my book as a text intended for students at the senior/first year graduate level and for process engineers in the microelectronics industry, This book is not intended to be bibliographical, and it does not cover every new material being studied for chemical vapor deposition. On the other hand, it does present the principles of CVD at a fundamental level while uniting them with the needs of the microelectronics industry.

Klappentext

This timely reference provides an integrated, ultidisciplinary approach to CVD on a relatively fundamental level, enabling researchers with a basic background in any engineering field to readily understand and apply CVD techniques. At the same time, it becomes the first work to address CVD from the perspective of the properties of thin films and show how to achieve these properties by understanding and modifying deposition conditions.


Inhalt

  1. Introduction.- 2. Thin Film Phenomena.- 3. Manufacturability.- 4. Chemical Equilibrium and Kinetics.- 5. Reactor Design for Thermal CVD.- 6. Fundamentals of Plasma Chemistry.- 7. Processing Plasmas and Reactors.- 8. CVD of Conductors.- 9. CVD of Dielectrics.- 10. CVD of Semiconductors.- 11. Emerging CVD Techniques.- AppendixVacuum Techniques for CVD.- A.1 Fundamentals of Vaccum System Design.- A.2 Typical Hardware Configurations.

Weitere Informationen

  • Allgemeine Informationen
    • GTIN 09781475747539
    • Genre Elektrotechnik
    • Auflage Softcover reprint of the original 1st edition 1995
    • Sprache Englisch
    • Lesemotiv Verstehen
    • Anzahl Seiten 308
    • Größe H235mm x B155mm x T17mm
    • Jahr 2013
    • EAN 9781475747539
    • Format Kartonierter Einband
    • ISBN 1475747535
    • Veröffentlichung 22.06.2013
    • Titel Chemical Vapor Deposition
    • Autor Srinivasan Sivaram
    • Untertitel Thermal and Plasma Deposition of Electronic Materials
    • Gewicht 470g
    • Herausgeber Springer US

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