Reactive Multilayer Foils

Reactive multilayer foils have attracted intense
research attention in recent years, expecially for
their applications as local heat sources in
joining.In this study, reactive multilayer foils are
fabricated by a cold rolling method. Unlike the
generally physical vapor deposited multilayers, the
cold rolled foils possess unique combustion
synthesis behaviors due to their unique structures.
They provide an ideal opportunity to study the
details of the synthesis process in different
reactive multilayer systems.Silicon wafers are
successfully bonded using reactive Ni/Al multilayer
foils as local heat sources. The localized heating
and rapid cooling nature of reactive foil bonding
make this process an ideal method for silicon wafer
bonding and MEMS wafer level packaging
applications.These results should help shed some
light on the development of simple and cost
effective fabrication methods for reactive
multilayer foils, and should be especially useful
for professionals and students in the material
synthesis and MEMS and microelectronics packaging
fields.

Autorentext

Xiaotun Qiu received his Bachelor degree from Tsinghua University in 2004 and Master of Science degree from Louisiana State University in 2007. He is now a Ph.D. student at Arizona State University. His research interests are MEMS,fabrication and application of reactive multilayer foils, and micropackaging.

Klappentext

Reactive multilayer foils have attracted intense research attention in recent years, expecially for their applications as local heat sources in joining.In this study, reactive multilayer foils are fabricated by a cold rolling method. Unlike the generally physical vapor deposited multilayers, the cold rolled foils possess unique combustion synthesis behaviors due to their unique structures. They provide an ideal opportunity to study the details of the synthesis process in different reactive multilayer systems.Silicon wafers are successfully bonded using reactive Ni/Al multilayer foils as local heat sources. The localized heating and rapid cooling nature of reactive foil bonding make this process an ideal method for silicon wafer bonding and MEMS wafer level packaging applications.These results should help shed some light on the development of simple and cost effective fabrication methods for reactive multilayer foils, and should be especially useful for professionals and students in the material synthesis and MEMS and microelectronics packaging fields.