3rd International Congress of Electrical and Computer Engineering

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Details

This proceedings presents the papers included in the 3rd International Congress of Electrical and Computer Engineering (ICECENG), which took place in Bandirma, Turkey, 27-30 November 2024. The conference aims to bring together researchers, developers, and students in computing, technology trends, artificial intelligence, and security who are interested in studying the application of formal methods to the construction and analysis of models describing technological processes at both micro and macro levels. ICECENG'24 also aims to provide a platform for discussing the issues, challenges, opportunities, and findings of computer engineering research. The conference seeks to provide some answers and explore the processes, actions, challenges, and outcomes of learning and teaching.


Presents papers from the 3rd International Congress of Electrical and Computer Engineering (ICECENG 2024) Brings together researchers, developers, students in computing, technology trends, artificial intelligence, and security Provides answers and explores the processes, actions, challenges, and outcomes of current trends in EE and CE

Autorentext

Muhammet Nuri Seyman works as aprofessor at Electrical and Electronics Engineering Department at the Bandirma Onyedi Eylul University of Turkey. His current research interests include multicarrier techniques such as OFDM, MC-CDMA, NOMA and MIMO systems and applications of artificial intelligence approaches for communications problems.


Inhalt

Introduction.- Computing.- Quantum Computing.- Cognitive Computing.- High Performance Computing.- Distributed and parallel systems.- Social Computing.- Cloud Computing.- Grid Computing.- Human-centered Computing.- Mobile Computing.- Complex Systems.- Communication.- Networking.- Wireless/ Mobile Communication.- Satellite Communication Systems.- 3G/4G/5G Network Evolution.- Connected Machines.- Mobile Adhoc Networks.- Open Spectrum Solutions.- Communication Protocols.- Cognitive Radio.- Mobile Apps.- Signal Processing.- Conclusion.

Weitere Informationen

  • Allgemeine Informationen
    • GTIN 09783031889981
    • Lesemotiv Verstehen
    • Genre Electrical Engineering
    • Editor Muhammet Nuri Seyman
    • Sprache Englisch
    • Anzahl Seiten 532
    • Herausgeber Springer
    • Größe H241mm x B160mm x T34mm
    • Jahr 2025
    • EAN 9783031889981
    • Format Fester Einband
    • ISBN 3031889983
    • Veröffentlichung 14.10.2025
    • Titel 3rd International Congress of Electrical and Computer Engineering
    • Untertitel ICECENG 2024
    • Gewicht 955g

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