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A Novel LVSD Design and its Robustness to Process Variation Effects
Details
Due to the aggressive scaling in the IC design, interconnect delay has adversely been affected, which subsequently reduces the performance. This problem can be mitigated by employing line drivers but they have high power consumption. Low-swing signalling techniques can provide high-speed signalling with low-power consumption, and most schemes are immune to noise as they have good signal-to-noise-ratio (SNR). However, they tend to have large area penalty and complexity as they require additional circuitry. A diode-connected driver circuit has the best attributes over other drivers in terms of low power, low delay, good SNR and low area-overhead. By incorporating a diode-connected configuration at the output, it can provide a high-speed signalling due to its high-driving capability. However, this configuration also has its limitations due to its inept adaptability to process variations, as well as leakage currents. To address these limitations, two novel driver schemes have been designed, where they have significant improvement in terms of delay, power consumption, noise and robustness against PVT effect and external disturbances such as crosstalk and single-event-upsets.
Autorentext
Nor M. Muzlifah received B.Eng. degree in Electric-Telecommunication from Universiti Teknologi Malaysia, in 2005; M.Sc. degree in Electronics System Design Engineering from Universiti Sains Malaysia, in 2006; and a Ph.D. degree in Microelectronics System Design from Newcastle University, UK in 2011. She is currently an IEEE and IET member.
Weitere Informationen
- Allgemeine Informationen
- GTIN 09783330032460
- Genre Electrical Engineering
- Sprache Englisch
- Anzahl Seiten 220
- Herausgeber LAP LAMBERT Academic Publishing
- Größe H220mm x B150mm x T14mm
- Jahr 2017
- EAN 9783330032460
- Format Kartonierter Einband
- ISBN 3330032464
- Veröffentlichung 08.02.2017
- Titel A Novel LVSD Design and its Robustness to Process Variation Effects
- Autor Nor Muzlifah Mahyuddin
- Untertitel Low Power and Robust Techniques for CMOS Circuits
- Gewicht 346g