Adhesion 13

As I turn to write this Prefaee to another volume of papers presented at the Annual Conferenee on Adhesion and Adhesives, I am reflecting on how fortuna te we are to he ahle to eontinue to attraet hoth speakers and audienee of such high standard year after year. This field of scienee and technology continues to grow in size and importance, so that it is not so surprising that those interested from a very eonsiderahle range of countries and diseiplines are willing to come together and spend a couple of days each year exchanging ideas and views, hoth formally and informally. So, once again, I can and must express thanks to all those who have made this volume possihle: hoth those who presented the papers, and then rewrote them for puhlication, and those who through their attendance made the conference a vi ahle reality. K. W. ALLEN v Contents v PreJace.

Inhalt

1. The US Army's Adhesive Bonding Improvement Initiative.- 2. The Surface Characterisation and Adhesive Bonding of Aluminium.- 3. Surface Free Energy Calculation for Polymers by a Group Distribution Method.- 4. Role of Molecular Dissipation in Elastomer Adhesion.- 5. Energy Losses in Peeling of Unvulcanized Rubbers.- 6. Adhesion of Rubber to Rigid Substrates: Memory Effects and the Threshold Energy.- 7. The Current Situation for Hot-Melt Adhesives.- 8. Chemistry of Reactive Urethane Acrylate Adhesives.- 9. Moisture-Curable Polyurethane Adhesives and Sealants for Civil Engineering and Construction Applications.- 10. Composite to Metal Jointing for Transport Applications.- 11. Bonded Joint Design Analyses.- 12. Finite Element Modelling Applied to Crack Propagation Studies in Bonded Components.- 13. Effects of the Environment on Bonded Aluminium Joints: An Examination by Electron Microscopy.- 14. The Study of Strain Fields in Adhesive Joints by Laser Moiré Interferometry.- 15. The Selection of Adhesives for Aircraft Repairs Based on Fundamental Mechanical Properties of the Resins Themselves (Phase II).- 16. Studies of Titanium Primers for Adhesion by IETS.