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Advances in Structural Integrity for Mechanical, Civil, and Aerospace Applications
Details
This book includes select proceedings papers presented at the 4th Structural Integrity Conference and Exhibition (SICE-2022), organized at the Indian Institute of Technology (IIT), Hyderabad. The papers by eminent scientists and academicians broadly working in aerospace, civil, and mechanical and materials engineering within the areas of structural integrity, life prediction, and condition monitoring are classified under the domains of aerospace, fracture mechanics, fatigue, civil structures, experimental techniques, computation mechanics, molecular dynamics and nanostructures, smart materials, energy impact, dynamics, mechanisms, structural optimization, composites, AI/ML applications, additive and advanced manufacturing, bio-engineering, structural health monitoring, nondestructive testing, and damage and failure analysis. The contents of this book serves as a valuable resource for researchers, students, and practicing engineers alike.
Contents will benefit researchers, students and practicing engineers alike Presents state-of-the-art literature on the subject of structural integrity, life prediction, and condition monitoring Includes selected peer reviewed papers presented at the 4Th Structural Integrity Conference and Exhibition (SICE-2022)
Inhalt
- Effect of nanoparticle agglomeration in polymer nanocomposites: A mutiscale study.- 2. Improving The Setting Time Properties Of Cement Paste Using Rice Husk Ash.- 3. Fabrication of Functionally Gradient Material Using Hybrid Metal Additive Manufacturing.- 4. Analysis of CPW Fed Monopole Antenna as RF-based Sensor for Strain Sensing.- 5. Acoustic Emission-based Damage Detection with Fibre Bragg Grating Sensors.- 6. Mechanical and microstructural characterization of friction stir lap welded AA6061-T6/ AA7075-T6 joints.- 7. Effect of spark assisted polishing on the wear resistance of additive manufactured metallic components.- 8. Influence of Higher Vibration Modes on the Dynamic Analysis of Bridge Subjected to Moving Loads.
Weitere Informationen
- Allgemeine Informationen
- GTIN 09789819513000
- Lesemotiv Verstehen
- Genre Electrical Engineering
- Editor Rajesh Korla, Muvvala Gopinath, Eswara Prasad Korimilli, Murshid Imam, Prakhar Gupta
- Sprache Englisch
- Anzahl Seiten 412
- Herausgeber Springer-Verlag GmbH
- Größe H235mm x B155mm
- Jahr 2026
- EAN 9789819513000
- Format Kartonierter Einband
- ISBN 978-981-9513-00-0
- Titel Advances in Structural Integrity for Mechanical, Civil, and Aerospace Applications
- Untertitel Proceedings of SICE 2022, Volume 2