CFD Analysis of Processor Heat Sink

CHF 62.35
Auf Lager
SKU
HTC3DFLV04P
Stock 1 Verfügbar
Geliefert zwischen Mi., 25.02.2026 und Do., 26.02.2026

Details

Every computer consists a processor and every processor release heat due to impedance offered by electronic circuits to electric current. Increased processing power causes increased heat dissipation, making processor temperature rise. This causes reduced processing speed, shortened life, malfunction or in some cases failure and thermal shutdown of processor. In this book, forced air cooling system mounted on processor was investigated. Effect of various air inlet locations and air velocity on processor temperature were numerically analysed by commercially available computational fluid dynamics software. The results shows that modifications in conventions air cooling system can lower temperature and hot-spot on the heat sink.

Autorentext

An engineering professor with interest in Mechatronics, Machine Learning and CFD.

Weitere Informationen

  • Allgemeine Informationen
    • GTIN 09786202555432
    • Sprache Englisch
    • Genre Maschinenbau
    • Anzahl Seiten 104
    • Größe H220mm x B150mm x T7mm
    • Jahr 2020
    • EAN 9786202555432
    • Format Kartonierter Einband
    • ISBN 6202555432
    • Veröffentlichung 23.05.2020
    • Titel CFD Analysis of Processor Heat Sink
    • Autor Akshaykumar Dabhole
    • Untertitel Enhancement of Convective Heat Transfer Coefficient for Air Cooled Computer Processor Heat Sink
    • Gewicht 173g
    • Herausgeber LAP LAMBERT Academic Publishing

Bewertungen

Schreiben Sie eine Bewertung
Nur registrierte Benutzer können Bewertungen schreiben. Bitte loggen Sie sich ein oder erstellen Sie ein Konto.
Made with ♥ in Switzerland | ©2025 Avento by Gametime AG
Gametime AG | Hohlstrasse 216 | 8004 Zürich | Schweiz | UID: CHE-112.967.470
Kundenservice: customerservice@avento.shop | Tel: +41 44 248 38 38