Contactless VLSI Measurement and Testing Techniques

Provides a single-source reference on contactless probing approaches for VLSI testing and diagnostic measurement

Introduces readers to various optical contactless testing techniques, such as Electro-Optic Probing, Charge Density Probe, and Photo-emissive Probe

Discusses the applicability and adaptability of each technique, based on multilayer metallization, wafer level techniques, and invasiveness

Provides a comparison among various contactless testing techniques

Describes a variety of industrial applications of contactless VLSI testing

Autorentext

Dr. Selahattin Sayil is a Professor in the Philip M. Drayer Department of Electrical Engineering at Lamar University. His research focuses on VLSI Testing, Contactless Testing, Radiation effects modeling and hardening at the circuit level, Reliability analysis of low power designs, and Interconnect modeling and noise prediction.

Inhalt

1. Conventional Test Methods. 2. Testability Design.- 3. Other Techniques Based on the Contacting Probe.- 4. Contactless Testing.- 5. Electron-Beam and Photoemission Probing.- 6. Electro Optic Sampling and Charge Density Probe.- 7. Electric Force Microscope, Capacitive Coupling and Scanning Magneto-Resistive Probe.- 8. Probing Techniques Based on Light Emission from Chip.- 9. All Silicon Optical Technology for Contactless Testing of Integrated Circuits.- 10. Comparison of Contactless Testing Methodologies.