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Cook Over IP
Details
This book focuses on enabling internet connectivity to cordless kitchen appliances. It introduces the Ki Cordless Kitchen standard, describes the possible architectures to enable internet connectivity and dives deep into addressing the networking challenges.
Today many kitchen appliances are being connected to the internet to facilitate smart cooking. The Wireless Power Consortium is working on the Ki Cordless Kitchen standard to make wirelessly powered cordless appliances a reality. In Ki, the cordless appliances are powered by inductive power sources integrated into the kitchen countertops. The cordless appliance and the power transmitter exchange data using a time-slotted NFC channel.
The book describes architectures and solutions using lightweight TCP/IP stacks to optimise and seamlessly adapt TCP to the time-slotted, low data rate NFC channel, and thereby enable a truly IoT-based cooking experience for cordless kitchens.
Explains the cordless kitchen and explain the challenges to its implementation Includes practical information from research into real appliances from Philips in the Netherlands Of interest to companies, developers and researchers
Inhalt
Chapter 1. Introduction.- Chapter 2. Ki - The Cordless Kitchen.- Chapter 3. Architectures for Internet Connectivity.- Chapter 4. State of the art.- Chapter 5. Adapting TCP for the Bridge Architecture.- Chapter 6. Evaluation of the Bridge Architecture.- Chapter 7. Parametric Analysis of the Bridge Architecture.- Chapter 8. Conclusion.
Weitere Informationen
- Allgemeine Informationen
- GTIN 09783030858353
- Lesemotiv Verstehen
- Genre Electrical Engineering
- Auflage 1st edition 2021
- Sprache Englisch
- Anzahl Seiten 92
- Herausgeber Springer International Publishing
- Größe H235mm x B155mm x T6mm
- Jahr 2021
- EAN 9783030858353
- Format Kartonierter Einband
- ISBN 3030858359
- Veröffentlichung 29.09.2021
- Titel Cook Over IP
- Autor Shruthi Kashyap , Toine Staring , Ranga Rao Venkatesha Prasad , Vijay Rao
- Untertitel Cordless Smart Kitchen Appliance Architectures and Protocols
- Gewicht 154g