Cryogenic Microelectronic Systems for Ultra-Low Energy and Enhanced Performance

This book explores cryogenic computers to achieve faster operation and lower energy use. As computer components become smaller and generate more heat, traditional cooling methods struggle to keep up. By operating at cryogenic temperatures, these limitations can be overcomereducing heat, improving performance, and opening new possibilities for important applications such as large scale data centers and quantum computers. The approaches and physical models discussed in this book are valuable since these concepts offer a practical methodology for increasing computational computing power without being limited by heat and power dissipation.

The book explores how cryogenic temperatures can supercharge computing. Novel methods for designing and optimizing computer systems that operate at extremely low temperatures, improve performance, reduce power consumption, and tackle the fundamental physical limits faced by modern electronics are introduced in this book. From foundational physics-based principles and cryogenic equipment to innovative graph theoretic design, the book offers a fresh look at the future of high performance, energy efficient computing.

Provides a solid foundation in cryogenic computing and how it relates to traditional room temperature electronic design Describes a step-by-step framework for optimizing power, performance, and thermal loads in multi-temperature systems Includes novel solutions to some of the toughest challenges of computing, such as heat density and quantum effects

Autorentext

Nurzhan Zhuldassov****received his B.S. degree in Electrical and Computer Engineering from Nazarbayev University, Astana, Kazakhstan in 2018, and his M.S. in 2019 and Ph.D. in 2024, both in Electrical and Computer Engineering at the University of Rochester, Rochester, New York. In 2022 he was an intern at Google, Sunnyvale, California, and in 2023 he was an intern at Apple, Cupertino, California. His research interests encompass on-chip and package level power delivery networks, power integrity, cryogenic operation of MOSFETs, and optimization of cryogenic electronic circuits.

Eby G. Friedman****(Life Fellow, IEEE) received the B.S. degree in electrical engineering from the Lafayette College, and the M.S. and Ph.D. degrees in electrical engineering from the University of California at Irvine. He was with Hughes Aircraft Company, from 1979 to 1991, rising to Manager of the Signal Processing Design and Test Department, where he was responsible for the design and test of high performance digital and analog ICs. He has been with the Department of Electrical and Computer Engineering, University of Rochester, since 1991, where he is currently a Distinguished Professor and the Director of the High Performance VLSI/IC Design and Analysis Laboratory. He is also a Visiting Professor with the TechnionIsrael Institute of Technology, Haifa, Israel. He has authored more than 600 articles and book chapters, holds 29 patents, and has authored or edited 21 books in the fields of high speed and low power CMOS design techniques, 3-D design methodologies, high speed interconnect, superconductive circuits, and the theory and application of synchronous clock and power distribution networks. His current research and teaching interests include high performance synchronous digital and mixed-signal circuit design and analysis with application to high speed portable processors, low power wireless communications, and data centers. Dr. Friedman is a Senior Fulbright Fellow, a Fellow of the NAI, a National Sun Yat-sen University Honorary Chair Professor, and an Inaugural Member of the UC Irvine Engineering Hall of Fame. He was a recipient of the IEEE Circuits and Systems Mac Van Valkenburg Award, the IEEE Circuits and Systems Charles A. Desoer Technical Achievement Award, the University of Rochester Graduate Teaching Award and Lifetime Achievement Award, and the College of Engineering Teaching Excellence Award. He was the Editor-in-Chief and Chair of the Steering Committee of the IEEE Transactions on Very Large Scale Integration (VLSI) Systems, the Editor-in-Chief of the Microelectronics Journal, a Regional Editor of the Journal of Circuits, Systems and Computers, an editorial board member for numerous journals, and a program and technical chair for several IEEE conferences.

Inhalt

Chapter 1. Introduction.- Chapter 2. Cryogenic Systems for Electronic Applications.- Chapter 3. Semiconductor Behavior at Cryogenic Temperatures.- Chapter 4. Temperature-Frequency Boundary of Cryogenic Dynamic Logic.- Chapter 5. Thermal Optimization of Hybrid Cryogenic Computing Systems.- Chapter 6. Heat Load Efficiency in Multi-Temperature Zone Cryogenic Computing Systems.- Chapter 7. Integrated Multi-Temperature Cryogenic Computing Systems.- Chapter 8. Conclusions.