Designing 2D and 3D Network-on-Chip Architectures
Details
This book covers key concepts in the design of 2D and 3D Network-on-Chip interconnect. It highlights design challenges and discusses fundamentals of NoC technology, including architectures, algorithms and tools.
Describes essential theory, practice and state-of-the-art applications of 2D and 3D Network-on-Chip interconnect Enables readers to exploit parallelism in processor architecture, with interconnect design that is efficient in terms of energy and performance Covers topics not available in other books, such as NoC and distributed memory organization, dynamic memory management and abstract data type support in many-core platforms, and distributed hierarchical power management
Inhalt
Part I: Network-on-Chip Design Methodology.- Network-on-Chip Technology: A Paradigm Shift.- NoC Modeling and Topology Exploration.- Communication Architecture.- Power and Thermal Effects and Management.- NoC-based System Integration.- NoC Verification and Testing.- The Spidergon STNoC.- Middleware Memory Management in NoC.- On Designing 3-D Platforms.- The SYSMANTIC NoC Design and Prototyping Framework.- Part II: Suggested Projects.- Projects on Network-on Chip.
Weitere Informationen
- Allgemeine Informationen
- GTIN 09781461442738
- Genre Elektrotechnik
- Auflage 2014
- Sprache Englisch
- Lesemotiv Verstehen
- Anzahl Seiten 280
- Größe H241mm x B160mm x T19mm
- Jahr 2013
- EAN 9781461442738
- Format Fester Einband
- ISBN 1461442737
- Veröffentlichung 08.10.2013
- Titel Designing 2D and 3D Network-on-Chip Architectures
- Autor Konstantinos Tatas , Axel Jantsch , Dimitrios Soudris , Kostas Siozios
- Gewicht 588g
- Herausgeber Springer New York