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Dual in-line package
CHF 43.20
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SKU
9C92JGI6QJ8
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Geliefert zwischen Di., 25.11.2025 und Mi., 26.11.2025
Details
In microelectronics, a dual in-line package, sometimes called a DIL package, is an electronic device package with a rectangular housing and two parallel rows of electrical connecting pins. The pins are all parallel, point downward, and extend past the bottom plane of the package at least enough to be through-hole mounted to a printed circuit board, i.e. to pass through holes on the PCB and be soldered on the other side. DIP is also sometimes considered to stand for dual in-line pin, in which case the phrase "DIP package" is non-redundant. Generally, a DIP is relatively broadly defined as any rectangular package with two uniformly spaced parallel rows of pins pointing downward, whether it contains an IC chip or some other device, and whether the pins emerge from the sides of the package and bend downwards or emerge directly from the bottom of the package and are completely straight. In more specific usage, the term refers only to an IC package of the former description A DIP is usually referred to as a DIPn, where n is the total number of pins. For example, a microcircuit package with two rows of seven vertical leads would be a DIP14.
Weitere Informationen
- Allgemeine Informationen
- GTIN 09786130233723
- Genre Technik
- Editor Frederic P. Miller, Agnes F. Vandome, John McBrewster
- Sprache Englisch
- Anzahl Seiten 100
- Herausgeber Alphascript Publishing
- Größe H220mm x B150mm x T6mm
- Jahr 2009
- EAN 9786130233723
- Format Fachbuch
- ISBN 978-613-0-23372-3
- Titel Dual in-line package
- Untertitel Pin grid array, DIP switch, Chip carrier, Microelectronics, Through-hole technology, Printed circuit board, Soldering, Integrated circuit, Microprocessor, Rotary encoder, Light-emitting diode
- Gewicht 165g
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