Flip chip
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Details
Please note that the content of this book primarily consists of articles available from Wikipedia or other free sources online. Flip chip, also known as Controlled Collapse Chip Connection or its acronym, C4, is a method for interconnecting semiconductor devices, such as IC chips and Microelectromechanical systems, to external circuitry with solder bumps that have been deposited onto the chip pads. The solder bumps are deposited on the chip pads on the top side of the wafer during the final wafer processing step. In order to mount the chip to external circuitry (e.g., a circuit board or another chip or wafer), it is flipped over so that its top side faces down, and aligned so that its pads align with matching pads on the external circuit, and then the solder is flowed to complete the interconnect. This is in contrast to wire bonding, in which the chip is mounted upright and wires are used to interconnect the chip pads to external circuitry.
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GarantieWeitere Informationen
- Allgemeine Informationen
- GTIN 09786131703386
- Editor Frederic P. Miller, Agnes F. Vandome, John McBrewster
- Genre Physik & Astronomie
- Größe H220mm x B220mm
- EAN 9786131703386
- Format Kartonierter Einband
- Titel Flip chip
- Herausgeber Alphascript Publishing
- Anzahl Seiten 80
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