Handbook of Physical Vapor Deposition (PVD) Processing

This updated version of the popular handbook further explains all aspects of physical vapor deposition (PVD) process technology from the characterizing and preparing the substrate material, through deposition processing and film characterization, to post-deposition processing. The emphasis of the new edition remains on the aspects of the process flow that are critical to economical deposition of films that can meet the required performance specifications, with additional information to support the original material.

Autorentext

Donald M. Mattox obtained his B.S degree in Physics from Eastern Kentucky State University. He served as a meteorologist and Air Weather Officer in the USAF during and after the Korean War. He then obtained a M.S. degree in Solid State Physics from the University of Kentucky in 1960. In 1961 he went to work at Sandia National Laboratories (SNL). Don was a manager and member of the Technical staff at SNL for 27 years and has been a consultant to the vacuum coating industry for over 28 years. In 1995 he was the recipient of the American Vacuum Society Albert Nerken Award "For his invention of the ion plating process and its continued development." In 2007 Don received the Society of Vacuum Coaters Nathaniel Sugerman Award "For his development of the ion plating process and long-term commitment to education in the vacuum coating community.? Don has published numerous papers and book chapters on the subject of Physical Vapor Deposition (PVD) processing and technology transfer from R&D to production. He is the author of Handbook of Physical Vapor Deposition (PVD) Processing (1st edition 1998, 2nd edition 2010) published by Elsevier and Foundations of Vacuum Coating Technology, published by William Andrew/Elsevier (1st edition 2003).

Zusammenfassung
Explains various aspects of physical vapor deposition (PVD) process technology from the characterizing and preparing the substrate material, through deposition processing and film characterization, to post-deposition processing.

Inhalt

Introduction; Substrate ("Real") Surfaces and Surface Modification; The "Good" Vacuum (Low Pressure) Processing Environment; The Sub-Atmospheric Processing Environments; The Low-Pressure Plasma Processing Environment; Vacuum Evaporation and Vacuum Deposition; Physical Sputtering and Sputter Deposition (Sputtering); Arc Vapor Deposition; Ion Plating and Ion Beam Assisted Deposition; Atomistic Film Growth and Some Growth-Related Film Properties; Film Characterization and Some Basic Film Properties; Adhesion and Deadhesion; Cleaning; External Processing Environment; Transfer of Technology from R&D to Manufacturing