High Dielectric Constant Materials

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Issues relating to the high-K gate dielectric are among the greatest challenges for the evolving International Technology Roadmap for Semiconductors (ITRS). More than just an historical overview, this book will assess previous and present approaches related to scaling the gate dielectric and their impact, along with the creative directions and forthcoming challenges that will define the future of gate dielectric scaling technology. Topics include: an extensive review of Moore's Law, the classical regime for SiO2 gate dielectrics; the transition to silicon oxynitride gate dielectrics; the transition to high-K gate dielectrics (including the drive towards equivalent oxide thickness in the single-digit nanometer regime); and future directions and issues for ultimate technology generation scaling. The vision, wisdom, and experience of the team of authors will make this book a timely, relevant, and interesting, resource focusing on fundamentals of the 45 nm Technology Generation and beyond.


High-dielectric-constant materials have a huge potential for applications in microelectronic devices. This book provides the most comprehensive survey on their properties, processing and applications Includes supplementary material: sn.pub/extras

Inhalt
Classical Regime for SiO.- Brief Notes on the History of Gate Dielectrics in MOS Devices.- SiO2 Based MOSFETS: Film Growth and SiSiO2 Interface Properties.- Oxide Reliability Issues.- The Economic Implications of Moore's Law.- Transition to Silicon Oxynitrides.- Gate Dielectric Scaling to 2.01.0 nm: SiO2 and Silicon Oxynitride.- Optimal Scaling Methodologies and Transistor Performance.- Silicon Oxynitride Gate Dielectric for Reducing Gate Leakage and Boron Penetration Prior to High-k Gate Dielectric Implementation.- Transition to High-k Gate Dielectrics.- Alternative Dielectrics for Silicon-Based Transistors: Selection Via Multiple Criteria.- Materials Issues for High-k Gate Dielectric Selection and Integration.- Designing Interface Composition and Structure in High Dielectric Constant Gate Stacks.- Electronic Structure of Alternative High-k Dielectrics.- Physicochemical Properties of Selected 4d, 5d, and Rare Earth Metals in Silicon.- High-k Gate Dielectric Deposition Technologies.- Issues in Metal Gate Electrode Selection for Bulk CMOS Devices.- CMOS IC Fabrication Issues for High-k Gate Dielectric and Alternate Electrode Materials.- Characterization and Metrology of Medium Dielectric Constant Gate Dielectric Films.- Electrical Measurement Issues for Alternative Gate Stack Systems.- High-k Gate Dielectric Materials Integrated Circuit Device Design Issues.- Future Directions for Ultimate Scaling Technology Generations.- High-k Crystalline Gate Dielectrics: A Research Perspective.- High-k Crystalline Gate Dielectrics: An IC Manufacturer's Perspective.- Advanced MOS-Devices.

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Weitere Informationen

  • Allgemeine Informationen
    • GTIN 09783642059216
    • Auflage Softcover reprint of hardcover 1st edition 2005
    • Editor David Gilmer, Howard Huff
    • Sprache Englisch
    • Genre Maschinenbau
    • Lesemotiv Verstehen
    • Anzahl Seiten 736
    • Größe H235mm x B155mm x T40mm
    • Jahr 2010
    • EAN 9783642059216
    • Format Kartonierter Einband
    • ISBN 364205921X
    • Veröffentlichung 21.10.2010
    • Titel High Dielectric Constant Materials
    • Untertitel VLSI MOSFET Applications
    • Gewicht 1095g
    • Herausgeber Springer Berlin Heidelberg

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