High-k/Metal-gate Devices for Future CMOS Technology

The present work addresses the investigation of
high-? dielectrics and their applicability in
CMOS-devices, using metal-gate electrodes. The
contents firstly include the deposition of zirconium
dioxide and hafnium dioxide from the gas phase, using
organometallic precursors, and their physico-chemical
characterization. Furthermore, these material systems
are investigated regarding their thermodynamical
stability.
In the following, MOS-capacitors are fabricated by
the selective deposition of gate electrodes made from
aluminum, molybdenum, nickel, or titanium-nitride,
and characterized regarding their electrical behavior.
Results within this work demonstrate that well
balanced and correctly applied annealing of the
devices clearly improves electrical behavior. We
attribute these materials high potential to be
applied in near-future CMOS-technology.

Autorentext

Stephan Abermann wurde am 14.10.1978 in Innsbruck/Tirol geboren.
Seine Kindheit und Jugend verbrachte er in Kirchberg/Tirol. Nach
dem abgeschlossenen Studium der Werkstoffwissenschaften an der
Montanuniversität Leoben, wechselte er an die Technische
Universität Wien, wo er diese Dissertation verfasste, und seither
lebt.

Klappentext

The present work addresses the investigation of
high-? dielectrics and their applicability in
CMOS-devices, using metal-gate electrodes. The
contents firstly include the deposition of zirconium
dioxide and hafnium dioxide from the gas phase, using
organometallic precursors, and their physico-chemical
characterization. Furthermore, these material systems
are investigated regarding their thermodynamical
stability.
In the following, MOS-capacitors are fabricated by
the selective deposition of gate electrodes made from
aluminum, molybdenum, nickel, or titanium-nitride,
and characterized regarding their electrical behavior.
Results within this work demonstrate that well
balanced and correctly applied annealing of the
devices clearly improves electrical behavior. We
attribute these materials high potential to be
applied in near-future CMOS-technology.