HOLOGRAPHIC INTERFEROMETRY ASSESSMENT
Details
In any structural component where load path is diverted due to a change in section, i.e. a delaminated composite component, an adhesively bonded joint or ply drop-offs, and where out-of- plane stresses are induced, component surface displacements will occur. These out-of-plane surface displacements although relatively small, are indicative of internal structural problems that can be associated with component strength capacity limitations. This book discusses the application of a portable holographic interferometry testing system (PHITS) to study micro-deformations of a surface in a wide range of structural defects. The defects covered include delaminations, matrix cracks and matrix degradation due to heat, peel displacement behaviour in bonded lap-joints, debonded and weak bondlines. The results of this optical investigation have extended structural behaviour and mechanics understanding in all of the defect interaction.
Autorentext
Rikard Benton Heslehurst, PhD(UNSW), MEng(Aero), BEng(Aero) CPEng, FIEAust, FRAeS Aeronautical Engineering Officer-Royal Australian Air Force Senior Lecturer, University College, UNSW@ADFA Consultant Engineer.
Weitere Informationen
- Allgemeine Informationen
- GTIN 09783838322001
- Sprache Englisch
- Genre Maschinenbau
- Anzahl Seiten 304
- Größe H220mm x B150mm x T19mm
- Jahr 2009
- EAN 9783838322001
- Format Kartonierter Einband
- ISBN 3838322002
- Veröffentlichung 21.10.2009
- Titel HOLOGRAPHIC INTERFEROMETRY ASSESSMENT
- Autor Rikard Heslehurst
- Untertitel IN COMPOSITE AND ADHESIVELY BONDED STRUCTURAL DEFECTS
- Gewicht 471g
- Herausgeber LAP LAMBERT Academic Publishing