Hot Extrusion Dies

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Details

High pressures, elevated temperatures, complex and intricate section geometries lead to repeated mechanical and thermal stresses in the extrusion die and affiliated tooling. The focus of this monograph is on the following three distinct yet inter-related studies pertaining to the improvement of aluminum extrusion die: failure analysis, surface treatment, and effect of billet quality. The following topics are discussed in detail: investigation of various modes and critical failure types based on industrial data; FE simulation for identification of critical process parameters & design features in die fatigue-life; analysis of gas nitriding process for H13 steel and investigation of various effects including repeated nitriding, pre-nitriding surface preparation and die profile geometry on the nitriding performance; investigation of the effect of billet quality and related influencing extrusion parameters on the die service life; regression-based die life models; microstructural investigation of different billet samples and FE analysis of extrusion process to observe the influence of smelter (primary) and recycled (secondary) billets on the useful life of extrusion die.

Autorentext

Dr. S. Sohail Akhtar and Professor A. F. M. Arif (Mechanical Engineering Department, King Fahd University of Petroleum & Minerals, Saudi Arabia) have research interests in the areas of Design Engineering, Applied Materials and Manufacturing and Computational Applied Mechanics.

Weitere Informationen

  • Allgemeine Informationen
    • GTIN 09783846545126
    • Auflage Aufl.
    • Sprache Englisch
    • Genre Maschinenbau
    • Anzahl Seiten 268
    • Größe H220mm x B150mm x T17mm
    • Jahr 2011
    • EAN 9783846545126
    • Format Kartonierter Einband
    • ISBN 3846545120
    • Veröffentlichung 02.11.2011
    • Titel Hot Extrusion Dies
    • Autor Syed Sohail Akhtar , Abul Fazal M. Arif
    • Untertitel Failure Analysis, Nitriding & Effect of Billet Quality
    • Gewicht 417g
    • Herausgeber LAP LAMBERT Academic Publishing

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