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Integrated System-Level Modeling of Network-on-Chip enabled Multi-Processor Platforms
Details
We are presently observing a paradigm change in designing complex SoC as it occurs roughly every twelve years due to the exponentially increasing number of transistors on a chip. This design discontinuity, as all previous ones, is characterized by a move to a higher level of abstraction. This is required to cope with the rapidly increasing design costs. While the present paradigm change shares the move to a higher level of abstraction with all previous ones, there exists also a key difference. For the ?rst time shrinking geometries do not leadtoacorrespondingincreaseofperformance. InarecenttalkLisaSuofIBM pointed out that in 65nm technology only about 25% of performance increase can be attributed to scaling geometries while the lion share is due to innovative processor architecture [1]. We believe that this fact will revolutionize the entire semiconductor industry. What is the reason for the end of the traditional view of Moore's law? It is instructive to look at the major drivers of the semiconductor industry: wireless communications and multimedia. Both areas are characterized by a rapidly increasingdemandofcomputationalpowerinordertoprocessthesophisticated algorithmsnecessarytooptimallyutilizethepreciousresourcebandwidth. The computational power cannot be provided by traditional processor architectures and shared bus type of interconnects. The simple reason for this fact is energy ef?ciency: there exist orders of magnitude between the energy ef?ciency of an algorithm implemented as a ?xed functionality computational element and of a software implementation on a processor.
General introduction to SoC platform design and ESL design methodologies Comprehensive overview of the state-of-the-art research on ESL design Latest update on SystemC Transaction Level Modeling and standardization Transaction-level timing formalism for architectural modeling of complex SoC platforms Practical application in the context of ESL simulation and analysis tools and SoC architecture design
Inhalt
Foreword. Preface.- 1. Introduction.- 2. Embedded SOC Applications.- 3. Classification of Platform Elements.- 4. System Level Design Principles.- 5. Related Work.- 6. Methodology Overview.- 7. Unified Timing Model.- 8. MP-SOC Simulation Framework.- 9. Case Study.- 10. Summary.- Appendices. A: The OSCI TLM Standard. B: The OCPIP TL3 Channel. C: The Architects View Framework.- List of Figures. List of Tables. References.- Index.
Weitere Informationen
- Allgemeine Informationen
- GTIN 09789048172023
- Genre Elektrotechnik
- Auflage Softcover reprint of hardcover 1st edition 2006
- Sprache Englisch
- Lesemotiv Verstehen
- Anzahl Seiten 216
- Größe H240mm x B160mm x T12mm
- Jahr 2010
- EAN 9789048172023
- Format Kartonierter Einband
- ISBN 9048172020
- Veröffentlichung 19.11.2010
- Titel Integrated System-Level Modeling of Network-on-Chip enabled Multi-Processor Platforms
- Autor Tim Kogel , Heinrich Meyr , Rainer Leupers
- Gewicht 354g
- Herausgeber Springer Netherlands