Interfacial Science in Ceramic Joining

A unique combination of the basic science and fundamental aspects of joints and interfaces with the engineering aspects of the subject. Contributors include researchers drawn from several Eastern European countries.
Topics addressed include processing, interfacial reactions, graded joints, residual stress measurement and analysis, and failure and deformation.
Audience: Academic and industrial researchers and ceramic manufacturers interested in understanding the current state of the art in joining.

Inhalt
Structure, Composition and Thermal Stability of the Cu/Al2O3 Interface.- Diffusion Bonding of Si3N4-Ceramic to Transition Metals: Interfacial Microchemistry.- Improvement of Wetting and Bonding of Dissimilar Materials.- Wetting and Interfaces in Metal-Oxide Systems: Sensitivity to Experimental Conditions.- Kinetics of Spreading of Some Metal Melts over Covalent Ceramic Surfaces.- Chemical Interaction at the Initial Stage of Spreading.- Wettability Under Non-Reactive and Reactive Conditions in the Systems Ni/YSZ and Ni/Ti-TiO2/YSZ.- Wettability of TiB2 Ceramics by Liquid Cu and Ag-Cu Eutectic Alloys.- The Brazing of Ceramics: Material Science Aspect of Reactive Braze Alloys.- Transient Liquid Phase (TLP) Routes to the Joining of Structural Ceramics.- Joining of Si3N4 Using Al and Ni Interlayers.- Metallic Reaction for Joining of SiC Ceramics.- Alumina-Aluminium Interfaces.- Diffusion Processes at Liquid Metal/Ceramic Interfaces.- Role of Interfacial and Strain Energy for the Formation of Native Metal-Oxide Interfaces.- Phase Formation at Metal-Ceramic Interfaces.- TEM Examinations of B13O2/Al Reaction Zone.- Interfacial Reaction Kinetics of Silicon Nitride/Iron Alloys Diffusion Couples in the Range 1050°C/1250°C.- The Role of Intergranular Phases in Silicon Nitride and Silicon Carbide Direct Joining.- Interdiffusion at Metal/Oxide Interfaces Studied in Thin-Film Structures with AES Depth Profiling.- FT-IR and FT-Raman Study of Surfaces and Thin Layers.- Interfaces and Structural Integrity of Ceramic/Metal Joints: Reliability of Interface.- Fracture Criteria for Interface Cracks. A Case Study.- Interfaces in High-Strength, High-Temperature Ceramic Joints.- Dissipation Analysis of Interface Failure of Bimaterials.- Calculation and Experimental Determination of theResidual Stresses in a Metal-Ceramic Bond.- Application of the Blister Test to Adhesion Energy Measurements in Metal/Ceramic Film-on-Substrate Systems.- Microstructure, Mechanical Properties and Stability of Brazed Metal/Ceramic Systems: Technological Aspects and Testing Methodologies.- Joining of Silicon Nitride Ceramics to Titanium Alloy with an Interlayer.- Layered Composites Relationship between Residual Stresses and Fracture Behaviour.- Adhesion in Steel/Silicate Glass System.- Reactive Coatings on Ceramic Substrates.- Fabrication of Metal/Oxide Ceramic Functionally Graded Materials by Slip Casting.- The Joining of Alumina Membranes.- Joining Ceramics Using Preceramic Polymers.- The Importance of the Ceramic Interface in Electronic Applications.- Interaction of MLC BaTiO3 Based Ceramic with Silver Termination Ink.- Influence of Boundaries on Ionic Conductance.- Interface Effects in Ferroelectric Thin Films.- Characterisation of the Metal-Ceramic Direct Soldering by the Metal-Metal Diffusion Method.- Auhor Index.