Mechanics of Localized Slippage in Tactile Sensing

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This book examines all aspects of localized slippage, including modeling and simulation as well as the construction of novel sensors with slip tactile perception.

Localized slippage occurs during any relative sliding of soft contacts, ranging from human fingertips to robotic fingertips. Although this phenomenon is dominant for a very short time prior to gross slippage, localized slippage is a crucial factor for any to-be-developed soft sensing system to respond to slippage before it occurs. The content of this book addresses all aspects of localized slippage, including modeling and simulating it, as well as applying it to the construction of novel sensors with slip tactile perception.


Presents Mechanics of Localized Slippage in Tactile Sensing Offers for the first time a full description of a slippage of a soft fingertip by the proposed beam bundle model Written by leading experts in the field

Inhalt

Introduction.- Two Dimensional Beam Bundle Model of a Frictional Sliding Soft Fingertip.- Three-Dimensional Beam Bundle Model of a Sliding Soft Fingertip.- Modeling of a Sliding Human Fingertip.- Tactile Sensing via Micro Force/Moment Sensor.- Slip Perception via Soft Robotic Skin Made of Electroconductive Yarn.- Slip Perception using a Tactile Array Sensor.- Concluding Remarks.- Appendix A: Continuous Modeling 2D Elastic Deformation.- Appendix B: Numerical Integration of Ordinary Differential Equations.- Appendix C: Integral over Triangle.

Weitere Informationen

  • Allgemeine Informationen
    • GTIN 09783319041223
    • Auflage 2014
    • Sprache Englisch
    • Genre Allgemeines & Lexika
    • Lesemotiv Verstehen
    • Größe H241mm x B160mm x T19mm
    • Jahr 2014
    • EAN 9783319041223
    • Format Fester Einband
    • ISBN 3319041223
    • Veröffentlichung 14.01.2014
    • Titel Mechanics of Localized Slippage in Tactile Sensing
    • Autor Shinichi Hirai , Anh-Van Ho
    • Untertitel And Application to Soft Sensing Systems
    • Gewicht 535g
    • Herausgeber Springer International Publishing
    • Anzahl Seiten 244

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