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Modeling and Simulation in HPC and Cloud Systems
Details
Delivers a solid background for the development of a new generation of data intensive intelligent systems
Contains 5 chapters which are the summary of the tutorials and workshops organized as a part of the Summer School of the cHiPSet: Cost Action on New Trends in Modeling and Simulation in HPC Systems, held in Bucharest (Romania) on September 21-23, 2016
Presents recent research on high-performance modelling and simulation for big data applications
Provides a solid foundation for the development of a new generation of data-intensive intelligent systems Includes 5 chapters summarising the tutorials and workshops organised as part of the cHiPSet Summer School: Cost Action on New Trends in Modelling and Simulation in HPC Systems, held in Bucharest (Romania) on September 2123, 2016 Presents recent research on high-performance modelling and simulation for big data applications
Inhalt
Evaluating Distributed Systems and Applications through Accurate Models and Simulations.- Scheduling Data-Intensive Workloads in Large-Scale Distributed Systems: Trends and Challenges.- Design Patterns and Algorithmic Skeletons: A Brief Concordance.- Evaluation of Cloud Systems.- Science Gateways in HPC: Usability meets Efficiency and Effectiveness .- MobEmu: A Framework to Support Decentralized Ad-Hoc Networking.- Virtualisation Model For Processing of the Sensitive Mobile Data.- Analysis of selected cryptographic services for processing batch tasks in Cloud Computing systems.
Weitere Informationen
- Allgemeine Informationen
- GTIN 09783319892580
- Auflage Softcover reprint of the original 1st edition 2018
- Editor Joanna Ko odziej, Ciprian Dobre, Florin Pop
- Sprache Englisch
- Genre Allgemeines & Lexika
- Lesemotiv Verstehen
- Größe H235mm x B155mm x T10mm
- Jahr 2019
- EAN 9783319892580
- Format Kartonierter Einband
- ISBN 3319892584
- Veröffentlichung 07.06.2019
- Titel Modeling and Simulation in HPC and Cloud Systems
- Untertitel Studies in Big Data 36
- Gewicht 277g
- Herausgeber Springer International Publishing
- Anzahl Seiten 176