Modelling of Microfabrication Systems

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This is the first book to address modelling of systems that are important to the fabrication of three-dimensional microstructures. It is unique in that it focuses on high aspect ratio microtechnology, ranging from ion beam micromachining to x-ray lithography.

This book addresses modeling of systems that are important to the fabrication of three-dimensional microstructures. Selected topics are ion beam micromachining, x-ray lithography, laser chemical vapor deposition, photopolymerization, laser ablation, and thin films. Models simulating the behavior of these systems are presented, graphically illusratted, and discussed in the light of experimental results. Knowledge gained from such models is essential for system operation and optimization. This book is unique in that it focuses on high aspect ratio microtechnology. It will be invaluable to scientists, engineers, graduate students, and manufacturers engaged in research and development for enhancing the accuracy and precision of microfabrication systems for commercial applications.


First book on modelling of the processing techniques for microsystems Focusses on the fabrication of high-aspect ratio microparts, namely ion beam micromachining, x-ray lithography, laser chemical vapor deposition, laser photopolimerization, laser ablation Includes supplementary material: sn.pub/extras

Inhalt
1 Ion Beam.- 2 X-ray Lithography.- 3 Laser Chemical Vapor Deposition.- 4 Laser Photopolymerization.- 5 Laser Ablation.- 6 Thin Films.- References.

Weitere Informationen

  • Allgemeine Informationen
    • GTIN 09783642055362
    • Auflage Softcover reprint of hardcover 1st edition 2003
    • Sprache Englisch
    • Genre Allgemeines & Lexika
    • Lesemotiv Verstehen
    • Größe H235mm x B155mm x T16mm
    • Jahr 2010
    • EAN 9783642055362
    • Format Kartonierter Einband
    • ISBN 3642055362
    • Veröffentlichung 08.12.2010
    • Titel Modelling of Microfabrication Systems
    • Autor Weizhong Dai , Raja Nassar
    • Untertitel Microtechnology and MEMS
    • Gewicht 429g
    • Herausgeber Springer Berlin Heidelberg
    • Anzahl Seiten 280

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