More than Moore Technologies for Next Generation Computer Design

This book provides a comprehensive overview of key technologies being used to address challenges raised by continued device scaling and the extending gap between memory and central processing unit performance. Authors discuss in detail what are known commonly as More than Moore (MtM), technologies, which add value to devices by incorporating functionalities that do not necessarily scale according to Moore's Law. Coverage focuses on three key technologies needed for efficient power management and cost per performance: novel memories, 3D integration and photonic on-chip interconnect.

Introduces novel memories, using new materials and processing techniques, offering many advantages over dynamic memories such as traditional SRAM and e-DRAM Describes 3D integration of integrated circuits, enabling stacking of layers and shrinking device to device distance over traditional packages Enables readers to use on-chip integrated optics for interconnect Includes coverage of technology, design, and design automation

Autorentext
Rasit O. Topaloglu is an Advisory R&D Engineer at IBM.

Inhalt
Impact of TSV and Device Scaling on the Quality of 3D Ics.- 3D Integration Technology.- Design and Optimization of Spin-Transfer Torque MRAMs.- Embedded STT-MRAM: Device and Design.- A Thermal and Process Variation Aware MTJ Switching Model and Its Applications in Soft Error Analysis.- Nano-Photonic Networks-on-Chip for Future Chip Multiprocessors.- Design Automation for On-chip Nanophotonic Integration.