Nano-Bio- Electronic, Photonic and MEMS Packaging

CHF 263.15
Auf Lager
SKU
26TTA3T2DAA
Stock 1 Verfügbar
Geliefert zwischen Mi., 25.02.2026 und Do., 26.02.2026

Details

Nanotechnologies are being applied to the biotechnology area, especially in the area of nano material synthesis. This book offers an overview of nano and bio packaging. It includes a discussion of nano bio packaging materials and design with MD simulations.


Offers a comprehensive overview of nano and bio packaging Discusses nano bio packaging materials and design with MD simulations Discusses nano materials as power energy sources and their importance on the device level Discusses nanotubes, superhydrophobic self-clean Lotus surfaces Discusses nano packaging and thermal interfacial materials (TIMs) Discusses thermal science when designing at the device level packaging Covers nano chemistry for bio sensor / bio medical device packaging Includes supplementary material: sn.pub/extras

Klappentext

Nanotechnologies are frequently being applied to the biotechnology area, especially in nano material synthesis. Until recently, there has been little research into how to implement nano/bio materials at the device level. Nano-Bio- Electronic, Photonic and MEMS Packaging discusses how nanofabrication techniques can be used to customize packaging for nano devices with applications to biological and biomedical research and products. Covering such topics as nano bio sensing electronics, bio device packaging, NEMs for bio devices and much more, including:

  • Offering a comprehensive overview of nano and bio packaging
  • Discussing nano materials as power energy sources
  • Analyzing nanotubes, superhydrophobic self-clean Lotus surfaces
  • Covering nano chemistry for bio sensor / bio medical device packaging Nano-Bio- Electronic, Photonic and MEMS Packaging is the perfect book for all biomedical engineers, industrial electronics packaging engineers, and those engaged in bio nanotechnology applications research.

    Inhalt
    Nanomaterials for Microelectronic and Bio-packaging.- Nano-conductive Adhesives for Nano-electronics Interconnection.- Biomimetic Lotus Effect Surfaces for Nanopackaging.- Applications of Carbon Nanomaterials as Electrical Interconnects and Thermal Interface Materials.- Nanomaterials via NanoSpray Combustion Chemical Vapor Condensation, and Their Electronic Applications.- 1D Nanowire Electrode Materials for Power Sources of Microelectronics.- Mechanical Energy Harvesting Using Wurtzite Nanowires.- Nanolead-Free Solder Pastes for Low Processing Temperature Interconnect Applications in Microelectronic Packaging.- to Nanoparticle-Based Integrated Passives.- Thermally Conductive Nanocomposites.- Physical Properties and Mechanical Behavior of Carbon Nano-tubes (CNTs) and Carbon Nano-fibers (CNFs) as Thermal Interface Materials (TIMs) for High-Power Integrated Circuit (IC) Packages: Review and Extension.- On-Chip Thermal Management and Hot-Spot Remediation.- Some Aspects of Microchannel Heat Transfer.- Nanoprobes for Live-Cell Gene Detection.- Packaging for Bio-micro-electro-mechanical Systems (BioMEMS) and Microfluidic Chips.- Packaging of Biomolecular and Chemical Microsensors.- Nanobiosensing Electronics and Nanochemistry for Biosensor Packaging.- Molecular Dynamics Applications in Packaging.- Nanoscale Deformation and Strain Analysis by AFM/DIC Technique.- Nano-Scale and Atomistic-Scale Modeling of Advanced Materials.

Weitere Informationen

  • Allgemeine Informationen
    • GTIN 09781489983619
    • Auflage 2010
    • Editor C. P. Wong, Yi (Grace) Li, Kyoung-Sik Moon
    • Sprache Englisch
    • Genre Maschinenbau
    • Lesemotiv Verstehen
    • Anzahl Seiten 776
    • Größe H235mm x B155mm x T42mm
    • Jahr 2014
    • EAN 9781489983619
    • Format Kartonierter Einband
    • ISBN 1489983619
    • Veröffentlichung 01.09.2014
    • Titel Nano-Bio- Electronic, Photonic and MEMS Packaging
    • Gewicht 1153g
    • Herausgeber Springer US

Bewertungen

Schreiben Sie eine Bewertung
Nur registrierte Benutzer können Bewertungen schreiben. Bitte loggen Sie sich ein oder erstellen Sie ein Konto.
Made with ♥ in Switzerland | ©2025 Avento by Gametime AG
Gametime AG | Hohlstrasse 216 | 8004 Zürich | Schweiz | UID: CHE-112.967.470
Kundenservice: customerservice@avento.shop | Tel: +41 44 248 38 38