On-Chip Inductive Interconnects
Details
With the decrease in feature size of CMOS integrated
circuits, interconnect design has become an
important issue in high speed, high complexity
integrated circuits. Different design methodologies
have been proposed to improve circuit performance.
Wire sizing, driver sizing, repeater insertion, and
wire shaping are common techniques to enhance
circuit performance.
With increasing signal frequencies and the
corresponding decrease in signal transition times,
the interconnect impedance can behave inductively.
Line inductance introduces new tradeoffs in
interconnect design and driver sizing to decrease
the circuit delay. Different design methodologies
under an inductive environment are described in this
book. Including line inductance in the design
process can enhance both the delay and power as well
as improve the accuracy of the overall design
process. By including the on-chip inductance, the
efficiency of different circuit design techniques
such as wire sizing, driver sizing, repeater
insertion, and line tapering can be greatly
enhanced.
Autorentext
Magdy A. El-Moursy BS'96 and MS'00 Cairo University, Egypt and MS'02 and PhD'04 University of Rochester, NY, USA,STMicroelectronics, USA (03), Senior Design Engineer, Intel Corporation, OR, USA (04-06), Assistant Professor, German University in Cairo, Egypt (06-08), technical lead, Hardware Emulation Division, Mentor Graphics Corporation.
Klappentext
With the decrease in feature size of CMOS integrated circuits, interconnect design has become an important issue in high speed, high complexity integrated circuits. Different design methodologies have been proposed to improve circuit performance. Wire sizing, driver sizing, repeater insertion, and wire shaping are common techniques to enhance circuit performance. With increasing signal frequencies and the corresponding decrease in signal transition times, the interconnect impedance can behave inductively. Line inductance introduces new tradeoffs in interconnect design and driver sizing to decrease the circuit delay. Different design methodologies under an inductive environment are described in this book. Including line inductance in the design process can enhance both the delay and power as well as improve the accuracy of the overall design process. By including the on-chip inductance, the efficiency of different circuit design techniques such as wire sizing, driver sizing, repeater insertion, and line tapering can be greatly enhanced.
Weitere Informationen
- Allgemeine Informationen
- GTIN 09783639157246
- Anzahl Seiten 308
- Genre Wärme- und Energietechnik
- Herausgeber VDM Verlag Dr. Müller e.K.
- Größe H220mm x B220mm
- Jahr 2009
- EAN 9783639157246
- Format Kartonierter Einband (Kt)
- ISBN 978-3-639-15724-6
- Titel On-Chip Inductive Interconnects
- Autor Magdy El-Moursy
- Untertitel Design Methodologies
- Sprache Englisch