Photonic Packaging Sourcebook

Guiding readers all the way from basic calculations to optimizing fiber-chip coupling efficiency, this volume reflects the diversity of the field of packaging photonic devices and is the first and only comprehensive sourcebook on photonic assembly techniques.

This book serves as a guide on photonic assembly techniques. It provides an overview of today's state-of-the-art technologies for photonic packaging experts and professionals in the field. The text guides the readers to the practical use of optical connectors. It also assists engineers to find a way to an effective and inexpensive set-up for their own needs. In addition, many types of current industrial modules and state-of-the-art applications from single fiber to multi fiber are described in detail. Simulation techniques such as FEM, BPM and ray tracing are explained in depth. Finally, all recent reliability test procedures for datacom and telecom modules are illustrated in combination with related standardization aspects.

Provides an overview of today's state-of-the-art technologies Guides the reader through the practical use of optical connectors Presents effective and inexpensive set-up for engineers' needs Illustrates recent reliability test procedures for datacom and telecom modules in combination with related standardization aspects Includes supplementary material: sn.pub/extras

Autorentext
Prof. Dr. rer .nat. Dr.-Ing. habil Ulrich Fischer-Hirchert is CEO of HarzOptics GmbH, Wernigerode, and Professor of Communication Technics at the Harz University of Applied Sciences, Wernigerode.

Inhalt
Introduction into Photonic Packaging.- Optical waveguides.- Optical Mode Field Adaptation.- Fiber-chip-coupling.- RF Lines.- Soldering, Adhesive Bonding, Bonding.- Optical Coneection Technology.- Active Adjustment Techniques.- Passive Adjustment Techniques.- Optical Motherboard.- Fiber-Optic Modules.- From Chip Design to the Optimum Package.- Reliability Tests.- Abbreviations.- Index.