Pick-up Process Analysis of a Die Bonder

The gallium arsenide (GaAs) circuits in advanced communication application have been considered to profoundly supersede the conventional silicon-based counterpart. Great improvements in the packaging of GaAs devices are needed to overcome the imminent handicap of its fragile characteristic; Thin die represents the mainstream for IC packages to achieve the goal of manufacturing compact and light products with higher functionality. These trends tend to challenge the existing infrastructure, henceforth; the creative design in connection with a unique die bonder in fabrication has been presented in this book. The general process to pick up a die was comprehensively investigated and then analyzed with computer simulations. Experiments were conducted to verify the simulation results. The die cracks due to the ejecting needle; and the effects of parameter were analyzed by means of Taguchi Method. With this procedure, not only the parameters could be optimized but also the production yield was promoted. Besides, this method could be easily modified to simulate other type of die bonders with different mechanisms; even a new procedure could be derived for the next generational die bonder.

Autorentext

Yeong-Jyh Lin, Ph.D: IC Packaging and computer simultion in Mechanical Engin., National Cheng Kung Univ., R.O.C. Mechanics and research in mechanical design emphasizing computer simulation. Sheng-Jye Hwang, Ph.D: Polymer Processing in Mechanical Engin., Univ. of Illinois, Urbana-Champaign, USA Professor at Cheng Kung University, R.O.C.