Plasma-processing-induced Damage Of Thin Dielectric Films

In semiconductor industry, material property degradation due to process is a critical factor that limits the device performance. Process-induced damage on a variety of dielectric materials is discussed and measured. Results from various metrologies are packaged and correlated into systematic theory. Charge-induced, chemical, and physical damage source in plasma process environment is identified and optimized. Two sample types of dielectrics are investigated: high-k dielectrics used in device technology and low-k dielectrics as observed in interconnect technology.

Autorentext

He Ren received Ph.D degree in electrical engineering from University of Wisconsin, Madison, in 2011. He is currently working at Applied Materials, Inc. His research interests include electromagnetics, plasma diagnostics, and semiconductor design and fabrication. This book is 2012 Harold A. Peterson Award winner of ECE, UW-Madison.