Rapid Thermal Processing of Semiconductors

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Rapid thermal processing has contributed to the development of single wafer cluster processing tools and other innovations in integrated circuit manufacturing environments. Borisenko and Hesketh review theoretical and experimental progress in the field, discussing a wide range of materials, processes, and conditions. They thoroughly cover the work of international investigators in the field.

Autorentext
Victor E. Borisenko graduated in 1973 from the Belarusian State University of Informatics and Radioelectronics (BSUIR) as an engineer in semiconductor electronics. He received his first doctorate in physics and mathematics in 1980, his second one in 1988. Since 1990, he has held positions as a professor in many universities worldwide, including the University of Salford in England, the University of Wuppertal in Germany and the University of Electro-Communications in Tokyo, Japan. He now holds a chair as professor and vice-rector of BSUIR and acts as supervisor of the Interuniversity Center of Nanoelectronics and Novel Materials. Since 1995, Professor Borisenko organizes the international conference on physics, chemistry and applications of nanostructures `Nanomeeting? His research team focuses on fundamental electronic and optical properties of semiconducting silicides and low dimensional silicon based nanostructures, carrier transport in semiconductor/dielectric multiquantum wells and DNA, design of novel nanoelectronics and nanophotonic devices, quantum computing.

Inhalt

  1. Transient Heating of Semiconductors by Radiation.- 2. Recrystallization of Implanted Layers and Impurity Behavior in Silicon Crystals.- 3. Crystallization, Impurity Diffusion, and Segregation in Polycrystalline Silicon.- 4. Component Evaporation, Defect Annealing, and Impurity Diffusion in the IIIV Semiconductors.- 5. Diffusion Synthesis of Silicides in Thin-Film MetalSilicon Structures.- 6. Rapid Thermal Oxidation and Nitridation.- 7. Rapid Thermal Chemical Vapor Deposition.- References.

Weitere Informationen

  • Allgemeine Informationen
    • GTIN 09781489918062
    • Sprache Englisch
    • Genre Maschinenbau
    • Lesemotiv Verstehen
    • Anzahl Seiten 384
    • Größe H235mm x B155mm x T21mm
    • Jahr 2013
    • EAN 9781489918062
    • Format Kartonierter Einband
    • ISBN 148991806X
    • Veröffentlichung 20.06.2013
    • Titel Rapid Thermal Processing of Semiconductors
    • Autor Victor E. Borisenko , Peter J. Hesketh
    • Untertitel Microdevices
    • Gewicht 581g
    • Herausgeber Springer

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