Reliability Physics and Engineering

This book provides critically important information for designing and building reliable cost-effective products. It includes numerous example problems with solutions.

Provides comprehensive textbook on reliability physics of semiconductors, from fundamentals to applications

Explains the fundamentals of reliability physics and engineering tools for building better products

Contains statistical training and tools within the text

Includes new chapters on Physics of Degradation, and Resonance and Resonance-Induced Degradation.

Autorentext

J.W. McPherson is recognized internationally as an expert in Reliability Physics & Engineering. He has published over 200 papers on reliability, authored the Reliability Chapters for 4 Books, awarded 15 patents, and holds the title of Texas Instruments Senior Fellow Emeritus. He was the 1995 General Chairman of the IEEE International Reliability Physics Symposium and still serves on its Board of Directors. In 2004, Joe received the IEEE Engineer of the Year Award from the Texas Society of Professional Engineers. In 2006, he was the Chairman of the International Sematech Reliability Council. Joe is an IEEE Fellow and the Founder/CEO of McPherson Reliability Consulting, LLC. His semiconductor reliability expertise includes device-physics, design-in reliability, wafer-fabrication and assembly-related reliability issues. Several of the reliability models that are used today in the semiconductor industry are closely associated with his name.

Inhalt

Introduction.- Physics of Degradation.- Time Dependence of Materials and Device Degradation.- From Material/Device Degradation to Time-To-Failure.- Time-To-Failure Modeling.- Gaussian Statistics - An Overview.- Time-To-Failure Statistics.- Failure Rate Modeling.- Accelerated Degradation.- Acceleration Factor Modeling.- Ramp-To-Failure Testing.- Time-To-Failure Models for Selected Failure Mechanisms in Integrated Circuits.- Time-To-Failure Models for Selected Failure Mechanisms in Mechanical Engineering.- Conversion of Dynamical Stresses Into Effective Static Values.- Resonance and Resonance-Induced Degradation.- Increasing the Reliability of Device/Product Designs.- Screening.- Heat Generation and Dissipation.- Sampling Plans and Confidence Intervals.-