Wir verwenden Cookies und Analyse-Tools, um die Nutzerfreundlichkeit der Internet-Seite zu verbessern und für Marketingzwecke. Wenn Sie fortfahren, diese Seite zu verwenden, nehmen wir an, dass Sie damit einverstanden sind. Zur Datenschutzerklärung.
Semiconductor Product Engineering, Quality and Operations
Details
This book captures the author's 35+ years of learning & experience in the semiconductor chip industry to provide a proven roadmap for successful, new product introduction process, tailored specifically to the semiconductor industry. The content includes a simplified process flow, success metrics, execution guidelines, checklists & calculators. The presentation is based on a product engineering centric NPI hub and the author guides readers through the complete process of semiconductor new product introduction, ensuring a successful plan execution.
Provides semiconductor product engineers single-source reference for new product introduction Breaks down the process of new product introduction into phases and what should be focused on during each phase Enables readers to plan reliability qualification parameters & estimate quality levels for new products
Autorentext
A little bit about me. My college degrees include BS & MS in Computer Engineering both from University of California. I have been in the semiconductor industry since 1984 fulfilling several different roles with increasing complexity and responsibility as my skills & experience grew.
My first job was a process development engineer involved in the 1 to 2 um CMOS technologies. My most recent position has involved board level product management & operations. In the early days of my career I was developing transistors & memory cells (i.e the building blocks of every semiconductor product). Later on I was responsible for model parameter extractions which were the building blocks of SPICE transistor model developments. During the latter half of my career I became interested in product & test engineering. So I used my knowledge of basics to move my career in that direction. More recently I have managed new product introductions for several types of products including ASICs, FPGA & mixed signal products.
Klappentext
This book captures the author s 35+ years of learning & experience in the semiconductor chip industry to provide a proven roadmap for successful, new product introduction process, tailored specifically to the semiconductor industry. The content includes a simplified process flow, success metrics, execution guidelines, checklists & calculators. The presentation is based on a product engineering centric NPI hub and the author guides readers through the complete process of semiconductor new product introduction, ensuring a successful plan execution.
Inhalt
Introduction.- Overall Picture of Product Development stages & where product engineers add value.- Get to know your products(s) intimately.- Put your reliability qualification plan & schedule together.- Put your characterization plans & schedule together.- Engineering Sample Phase.- Process Skew Lots (Assess Yield Variations, Yield pitfalls).- Assess your products' Reliability using industry standard specifications.- Analysis of failures to root cause is the key to a robust product.- Get ready for Production Silicon.- Compliance to Industry & Customer Standards.- Ring out the kinks in your manufacturing flow early.- Enable your manufacturing sites.- Start looking at cost reduction & manufacturing simplification.- Finance - Budgeting for char., rel. qual, boards etc.
Weitere Informationen
- Allgemeine Informationen
- GTIN 09783031180293
- Lesemotiv Verstehen
- Genre Electrical Engineering
- Auflage 1st edition 2022
- Sprache Englisch
- Anzahl Seiten 132
- Herausgeber Springer International Publishing
- Größe H246mm x B173mm x T13mm
- Jahr 2022
- EAN 9783031180293
- Format Fester Einband
- ISBN 3031180291
- Veröffentlichung 06.12.2022
- Titel Semiconductor Product Engineering, Quality and Operations
- Autor Fariborz Barman
- Untertitel Deliver High Quality Products & Increase Profits
- Gewicht 411g