Solder Joint Technology

Solder joints are ubiquitous in electronic consumer products. With the European Union's directive to ban the use of lead-based (Pb) solders in these products, there is an urgent need for research on solder joint behavior under various driving forces in electronic manufacturing, and for development of lead-free solders. For example, spontaneous Sn whisker growth and electromigration-induced failure in solder joints are serious issues. Analyzing and improving reliability is quite complicated due to the combined effects of electrical, mechanical, chemical, and thermal forces on solder joints. This book thoroughly examines advanced materials reliability issues related to copper-tin reaction and electromigration in solder joints, and presents methods to prevent common reliability problems.

Addresses the urgent need for reliable, lead-free solders in electronic manufacturing Reviews the basic science of copper-tin reactions and electromigration Emphasizes reliability issues related to solder joint reactions and electromigration induced failure in electronic consumer products and computers Discusses the need for and suggests improvements in solder joint reliability and the science of solder joint behavior

Inhalt
CopperTin Reactions.- CopperTin Reactions in Bulk Samples.- CopperTin Reactions in Thin-Film Samples.- CopperTin Reactions in Flip Chip Solder Joints.- Kinetic Analysis of Flux-Driven Ripening of CopperTin Scallops.- Spontaneous Tin Whisker Growth: Mechanism and Prevention.- Solder Reactions on Nickel, Palladium, and Gold.- Electromigration and Thermomigration.- Fundamentals of Electromigration.- Electromigration in Flip Chip Solder Joints.- Polarity Effect of Electromigration on Solder Reactions.- Ductileto-Brittle Transition of Solder Joints Affected by CopperTin Reaction and Electromigration.- Thermomigration.