Sputtering Materials for VLSI and Thin Film Devices

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Suitable for the microelectronics and flat panel display industries, this book focuses on the development of sputtering targets for conductor, diffusion barrier, reflective, data storage and display applications. It discusses materials science fundamentals, types of metallic materials for conductors, diffusion barrier, data storage, and more.

Autorentext

Engineering Consultant at Praxair Inc., Orangeburg, New York, USA


Klappentext

The primary focus of this book is to link the role of sputtering methods, source of sputtering materials and characteristics of sputtered thin films as they apply to industries such as semiconductors, flat-panel displays, data storage and photovoltaics.

Sarkar reviews essential industry-related topics, including technology trends; process flows for device manufacturing; sputtering processes, including hollow cathode magnetron; materials science of sputtering target and thin films; and productivity issues.

Properties of a wide variety of thin films are covered, including silicides, conductors, diffusion barriers, transparent conducting oxides, magnetic films etc.

The author presents various case studies and real-world examples of troubleshooting in an industrial setting.



Zusammenfassung
Reviews microelectronics industry topics such as history of inventions and technology trends, recent developments in sputtering technologies, manufacturing steps that require sputtering of thin films, the properties of thin films and the role of sputtering target performance on overall productivity of various processes.

Inhalt

Chapter 1: Sputtering materials for microelectronic industryChapter 2: Sputter deposition of thin filmsChapter 3: Performance of sputtering targets and productivityChapter 4: Sputtering target manufacturingChapter 5: Sputtering targets for integrated circuitsChapter 6: Sputtering targets for displays and photovoltaic devicesChapter 7: Ferromagnetic sputtering targets for silicide and data storage applicationsChapter 8: TroubleshootingAppendix I Diffusion and phase transformationAppendix II Crystallographic textureAppendix III Phase change materialsAppendix IV Mechanical property evaluationAppendix V Units and conversion factorsAppendix VI Periodic table

Weitere Informationen

  • Allgemeine Informationen
    • GTIN 09780815515937
    • Sprache Englisch
    • Anzahl Seiten 608
    • Größe H241mm x B194mm x T32mm
    • Jahr 2013
    • EAN 9780815515937
    • Format Fester Einband
    • ISBN 978-0-8155-1593-7
    • Veröffentlichung 25.10.2013
    • Titel Sputtering Materials for VLSI and Thin Film Devices
    • Autor Jaydeep Sarkar
    • Gewicht 1398g
    • Herausgeber Elsevier LTD, Oxford

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