Stress Analysis of Bonded Assemblies: Applications in Microelectronics

Four analytical models are developed for predictingthe maximum shearing displacement in a bondedassembly under global thermal mismatch loading.Analytical model includes: i) elastic analysis, ii)elasto-plastic analysis, iii) viscoelastic analysis,and iv) viscoelastic-plastic analysis.All results have been derived as closed-formcorrection factors to be applied to the easilycalculated unconstrained shear displacement to obtainthe maximum shear displacement. The motivation fordetermining the maximum shear displacement is tocompute the maximum shear strain, which is then usedto estimate the cycles-to-failure by means of afatigue law.The analytical relations derived are simple,easy-to-use, and helpful for studying the interactionamong the various design parameters. The analyticalrelations are in good agreement with existingexperimental and numerical results.

Klappentext
Four analytical models are developed for predicting the maximum shearing displacement in a bonded assembly under global thermal mismatch loading. Analytical model includes: i) elastic analysis, ii) elasto-plastic analysis, iii) viscoelastic analysis, and iv) viscoelastic-plastic analysis. All results have been derived as closed-form correction factors to be applied to the easily calculated unconstrained shear displacement to obtain the maximum shear displacement. The motivation for determining the maximum shear displacement is to compute the maximum shear strain, which is then used to estimate the cycles-to-failure by means of a fatigue law. The analytical relations derived are simple, easy-to-use, and helpful for studying the interaction among the various design parameters. The analytical relations are in good agreement with existing experimental and numerical results.