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Technology of Integrated Circuits
Details
Strongly involved with SIEMENS Corp. in the tremendous recent developments of process technologies for IC fabrication the authors comprehensively record their authoritative knowledge and practical experience. New materials , modern planar technology, process designs for CMOS, Bipolar, BICMOS and smart-power technologies, self-adjusting doping techniques are just a few of the highlights. With its strong application-orientation this is a need-to-have book for professionals in semiconductor industries. Senior students in electrical engineering and physics can use it as a textbook because of the systematic treatment of the subjects. With regard to their later careers as industrial engineers they will particularly appreciate the deep insight into the actual methods and problems of IC manufacturing.
This is the first book in which the tremendous developments of the recent years are recorded The authors played active roles in the research projects which lead to this new technologies Revised translation of a well-established German graduate textbook Includes supplementary material: sn.pub/extras
Inhalt
1 Introduction.- 2 Basic principles of integrated circuits technology.- 3 Film technology.- 4 Lithography.- 5 Etching technology.- 6 Doping technology.- 7 Cleaning technology.- 8 Process integration.- References.
Weitere Informationen
- Allgemeine Informationen
- GTIN 09783642085475
- Genre Elektrotechnik
- Sprache Englisch
- Lesemotiv Verstehen
- Anzahl Seiten 360
- Größe H235mm x B155mm x T20mm
- Jahr 2010
- EAN 9783642085475
- Format Kartonierter Einband
- ISBN 3642085474
- Veröffentlichung 21.10.2010
- Titel Technology of Integrated Circuits
- Autor D. Widmann , H. Mader , H. Friedrich
- Untertitel Springer Series in Advanced Microelectronics 2
- Gewicht 546g
- Herausgeber Springer