Thermal Copper Pillar Bump
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QOLLIMH97PE
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Geliefert zwischen Mi., 29.10.2025 und Do., 30.10.2025
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High Quality Content by WIKIPEDIA articles! The thermal copper pillar bump, also known as the "thermal bump", is a thermoelectric device made from thin-film thermoelectric material embedded in flip chip interconnects (in particular copper pillar solder bumps) for use in electronics and optoelectronic packaging, including: flip chip packaging of CPU and GPU integrated circuits (chips), laser diodes, and semiconductor optical amplifiers (SOA). Unlike conventional solder bumps that provide an electrical path and a mechanical for connection to the package, thermal bumps act as solid-state heat pumps and add thermal management functionality locally on the surface of a chip or to another electrical component. The diameter of a thermal bump is 238 m (micrometres) and 60 m high.
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GarantieWeitere Informationen
- Allgemeine Informationen
- GTIN 09786131079009
- Genre Technik
- Editor Lambert M. Surhone, Miriam T. Timpledon, Susan F. Marseken
- Anzahl Seiten 136
- Herausgeber Betascript Publishing
- EAN 9786131079009
- Format Fachbuch
- Titel Thermal Copper Pillar Bump
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