Thermal Management of Electronic Systems II

The volume presents an overview of recent developments in the thermal management of electronic systems. This is increasingly recognised as an important factor in current design methodology. The topics covered include thermal management in general, analytical and computational thermal modelling, thermal characterisation of components, single and multiphase convective cooling, measurement techniques, thermomechanical modelling and thermally induced failure.
Audience: Research and development engineers and scientists whose work involves the design and manufacture of electronic systems.

Inhalt

Preface. 1: Invited Lectures. The Numerical Modelling of Heat Transfer in Electronic Systems: Challenges and Ideas of Answer; J. Saulnier. DELPHI: A Status Report on the ESPRIT Funded Project for the Creation and Validation of Thermal Models of Electronic Parts; H. Rosten. Temperature Effects on Reliability; M. Pecht. 2: Analytical and Computational Thermal Modeling. Numerical Simulation of Combined Conduction-Radiation Heat Transfer in PCB Assemblies for Space Applications: Experimental Validation; P. Lybaert, et al. Conjugate Model of a Pinned-Finned Heat-Sink Using a Hybrid Conductance and CFD Model within an Integrated MCAE Tool; D. Agonafer, A. Free. Analysis of 3D Conjugate Heat Transfer in Electronic Boards: Interaction between Three Integrated Circuits; B. Fourka, J.B. Saulnier. Heat Transfer in Tridimensional Plastic Packages Stacks of Memory Chips; Y. Scudeller, C. Val. Electrothermal Simulation of Analogue Integrated Circuits with ETS; W. Van Petegem, et al. Calculations of the Temperature Distribution Throughout Electronic Equipments by the Boundary Element Method; J.P. Fradin, B. Desaunettes. An Interactive Thermal Characterisation of Component Placement; J.L. Blanchard, S. Louage. 3: Thermal Characterisation. Thermal Characterisation of Electronic Devices by means of Improved Boundary Condition independent Compact Models; H. Vinke, C. Lasance. Experimental Validation methods for Thermal Models; W. Temmerman, et al. Experimental Thermal Characterisation of Electronic Packages in a Fluid Bath Environment; F. Christiaens, et al. Modelling of IC-Packages based on Thermal Characteristics; I. Ewes. Characterisation of Thermally Enhanced Plastic Packages; A. Björneklett, G. Gustavsson. Thermal Characterization of Multistripe Heterostructure Lasers; V. Lepaludier, Y. Scudeller. Application of Thermal Territories for Air Cooled Circuit Board Design; A. Mälhammar. Thermal Impedance Evaluation with Different Power Profiles; V. Motta. Thermal Characterisation and Modelisation of Multichip Modules Using Standard Electronic Packages; A. Belache, et al. Measurement of Practical Thermal Resistance Values for Multi- Cavities Power Hybrids (MCPH) in a Vacuum Environment; D. Petitjean, et al. 4: Single and Multi-Phase Convective Cooling. Boiling and Condensation Heat Transfer in Narrow Channels of Thermosiphons for Cooling of Electronic Components; N. Tengblad, B. Palm. Application of Phase Change Materials (PCMs) to the Passive Thermal Control of a Plastic Quad Flat Package: Effect of Orientation of the Package; D. Pal, Y. Joshi. High Performance Air Cooled Heat-Sinks for Power Packages; A. Aranyosi, et al. Thermal Control of Broadcast Transmitters by Air Cooled Cold Plates; G. Cesini, et al. Natural Convection Experiments with Cuboids and Cylinders of Equal Area; R. Van Es, C. Lasance. Natural Convection Heat Transfer of Metal Cuboids Flush-Mounted in a Horizontal Plate; J. Drabbels. 5: Measurement Techniques. Visualisation of Natural Convection in Inclined Heated Parallel Plates; O. Manca, et al. New Jedec Standards for Thermal Measurements: Review and Examples; V. Motta. Experimental Study on Local Convective Heat Transfer from Protruding Cubical Components; E. Meinders, et al. Modelling of Axial Fans for Electronic Equipment; J. Henissen, et al. 6: Thermomechanical Modelling. Thermal Degradation of Power Modules; L. Tielemans, et al. Thermal and Thermomechanical Modelling of Ball Grid Array Packages; T. Fromont. Thermal and Thermomechanical Evaluation of a `Chip in Moulded Interconnect Device'; F. Christiaens, et al. Thermal and Mechanical Characterization of Electronic Packages in Extremely High Frequency Applications by means of Finite Element Analysis; J.P Sommer, et al. Author Index.