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Through-Silicon Vias in SiGe BiCMOS and Interposer Technologies for Sub-THz Applications
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Geliefert zwischen Fr., 21.11.2025 und Mo., 24.11.2025
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In the dissertation "Through-Silicon Vias in SiGe BiCMOS and Interposer Technologies for sub-THz Applications", a through-silicon via (TSV) technology module is developed targeting high frequency packaging applications in the millimeter-wave and sub-THz frequency range. Based on a high-performance 130 nm SiGe BiCMOS technology, TSVs are embedded in a via-middle integration approach. The TSV process module consists of the TSV integration, a carrier wafer handling and a wafer backside process to realize a redistribution layer. A process flow was developed to realize TSV structures with various geometries to ensure a high TSV design flexibility. The TSV process module can be applied for SiGe BiCMOS as well as for interposer technologies. High-performance TSV interconnections have been simulated to optimize their electrical properties. TSVs were electrically characterized and 3D transitions with low insertion loss <1 dB up to 300 GHz have been demonstrated thus providing excellent RF performance up to sub-THz frequencies. Different application areas like RF grounding, interposers with integrated waveguides as well as 300 GHz antennas are demonstrated. The potential of millimeter-wave packaging and 3D integration was evaluated. In this work, the use of TSVs for the millimeter wave and sub-THz frequency range was demonstrated. This opens up new possibilities for system integration and packaging of ultra-high frequency systems.
Weitere Informationen
- Allgemeine Informationen
- GTIN 09783961001965
- Anzahl Seiten 210
- Lesemotiv Verstehen
- Genre Thermal Engineering
- Herausgeber Technische Universität Chemnitz
- Gewicht 320g
- Größe H210mm x B12mm x T148mm
- Jahr 2023
- EAN 9783961001965
- Format Dissertationen / Habil.-Schrif
- ISBN 978-3-96100-196-5
- Titel Through-Silicon Vias in SiGe BiCMOS and Interposer Technologies for Sub-THz Applications
- Autor Matthias Wietstruck
- Sprache Englisch
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