Wafer-Level Packaging
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Details
Please note that the content of this book primarily consists of articles available from Wikipedia or other free sources online. Wafer-Level Packaging (WLP) refers to the technology of packaging an integrated circuit at wafer level. WLP is essentially a true chip scale package (CSP) technology, since the resulting package is practically of the same size as the die.. Wafer-level packaging has the ability to enable true integration of wafer fab, packaging, test, and burn-in at wafer level in order to streamline the manufacturing process undergone by a device from silicon start to customer shipment.
Weitere Informationen
- Allgemeine Informationen
- GTIN 09786130993849
- Anzahl Seiten 88
- Genre Wärme- und Energietechnik
- Editor Lambert M. Surhone, Miriam T. Timpledon, Susan F. Marseken
- Herausgeber Betascript Publishing
- Größe H220mm x B220mm
- EAN 9786130993849
- Format Fachbuch
- Titel Wafer-Level Packaging
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